Hwaseong, South Korea

Teahwa Jeong

This inventor holds 5 USPTO granted patents and 2 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2020-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Teahwa Jeong. Retrieved from https://idiyas.com/inventor/teahwa-jeong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 100.0

Average Co-Inventor Count = 5.5

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2020-2025

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5 patents (USPTO):Explore Patents

Title: Teahwa Jeong: Innovator in Semiconductor Technology

Introduction

Teahwa Jeong is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 5 patents. His work focuses on innovative methods for manufacturing semiconductor packages, which are crucial for modern electronic devices.

Latest Patents

One of Teahwa Jeong's latest patents is related to an interconnection structure and semiconductor package. This patent outlines a method for manufacturing a semiconductor package that includes forming a photoimageable dielectric layer on a substrate with a pad. The process involves creating a preliminary via hole to expose the pad, followed by the formation of a hard mask layer and etching to create a via hole, a first hole, and a trench. Additionally, a metal layer is formed on the dielectric layer, which is connected to the pad, and is then planarized to create a wiring pattern. A semiconductor chip is placed on this wiring pattern, ensuring electrical connectivity.

Another significant patent describes a semiconductor package that features a redistribution substrate with a redistribution pattern. This package includes a semiconductor chip mounted on the top surface of the substrate and a connection terminal linking the chip to the substrate. The design incorporates a pad structure that connects electrically to the redistribution pattern, enhancing the functionality and efficiency of the semiconductor package.

Career Highlights

Teahwa Jeong is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to the development of advanced electronic components.

Collaborations

Throughout his career, Teahwa Jeong has collaborated with notable colleagues, including Ju-Il Choi and Jin Ho An. These collaborations have fostered innovation and have been instrumental in the successful development of various semiconductor technologies.

Conclusion

Teahwa Jeong's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as a key innovator in the field. His advancements in semiconductor packaging are paving the way for future developments in electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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