The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2023
Filed:
May. 04, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Gyuho Kang, Cheonan-si, KR;
Seong-Hoon Bae, Cheonan-si, KR;
Jin Ho An, Seoul, KR;
Teahwa Jeong, Hwaseong-si, KR;
Ju-Il Choi, Seongnam-si, KR;
Atsushi Fujisaki, Seongnam-si, KR;
Abstract
A semiconductor package includes; a redistribution substrate including a redistribution pattern, a semiconductor chip mounted on a top surface of the redistribution substrate, and a connection terminal between the semiconductor chip and the redistribution substrate. The redistribution substrate further includes; a pad structure including a pad interconnection and a pad via, disposed between the redistribution pattern and the connection terminal, wherein the pad structure is electrically connected to the redistribution pattern and a top surface of the pad structure contacts the connection terminal, a shaped insulating pattern disposed on a top surface of the redistribution pattern, and a pad seed pattern disposed on the redistribution pattern and covering the shaped insulating pattern.