The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Mar. 26, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jinho Chun, Seoul, KR;
Jin Ho An, Seoul, KR;
Teahwa Jeong, Hwaseong-si, KR;
Jeonggi Jin, Seoul, KR;
Ju-Il Choi, Seongnam-si, KR;
Atsushi Fujisaki, Seongnam-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
There are provided semiconductor packages including a redistribution substrate and a semiconductor chip mounted on the redistribution substrate. The redistribution substrate may include a lower protective layer, a first conductive pattern disposed on the lower protective layer, a first insulating layer surrounding the first conductive pattern and disposed on the lower protective layer, and a second insulating layer disposed on the first insulating layer. The first insulating layer may include a first upper surface that includes a first flat portion extending parallel to an upper surface of the lower protective layer, and a first recess facing the lower protective layer and in contact with the first conductive pattern. The first recess may be directly connected to the first conductive pattern.