Seoul, South Korea

Jeonggi Jin

This inventor holds 31 USPTO granted patents and 19 published patent applications, primarily in Semiconductor Packaging. Top assignees: Samsung Electronics Co., Ltd., Samsung Electronics Ltd.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jeonggi Jin. Retrieved from https://idiyas.com/inventor/jeonggi-jin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 31 

% Patents Active = 93.5

Average Co-Inventor Count = 5.7

ph-index = 4

Forward Citations = 31(Granted Patents)


Location History:

  • Osan-si, KR (2014)
  • Suwon-si, KP (2022)
  • Seoul, KR (2017 - 2024)
  • Suwon-si, KR (2024)

Company Filing History:


Years Active: 2014-2026

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Areas of Expertise:
Semiconductor Package
Interconnection Structure
Manufacturing Method
Semiconductor Device
Redistribution Patterns
Through Electrodes
Protective Layer
Electrical Interconnections
Insulating Layer
Stress Buffer Layers
Fabrication Methods
Electronic Device
31 patents (USPTO):Explore Patents

Title: Jeonggi Jin: Innovating Semiconductor Solutions in Seoul

Introduction: Jeonggi Jin is a renowned inventor based in Seoul, South Korea, with an impressive portfolio of 23 patents. His work primarily focuses on semiconductor packages, which play a crucial role in the electronics industry. Jeonggi's contributions have significantly advanced the technology, making him a prominent figure in his field.

Latest Patents: Among his latest innovations, Jeonggi has developed advanced semiconductor packages that enhance performance and efficiency. One such patent describes a semiconductor package that features a redistribution substrate with a semiconductor chip on its first surface and a solder pattern on its second surface. This design includes an under-bump pattern coupled to the solder pattern, which contributes to the package's functionality. Another recent patent illustrates a redesign of a semiconductor package that employs a redistribution substrate, a semiconductor chip mounted on its top surface, and a conductive terminal on its bottom surface. The innovations in these patents reflect Jeonggi's commitment to pushing the boundaries of semiconductor technology.

Career Highlights: Jeonggi Jin is affiliated with Samsung Electronics Co., Ltd., a leading company in the technology sector. Throughout his career, he has demonstrated exceptional skill and dedication in his work, leading to numerous patents that showcase his innovative approach to semiconductor design and manufacturing. His experience at Samsung has provided him with a platform to implement his ideas and bring cutting-edge solutions to the market.

Collaborations: In his endeavors, Jeonggi has collaborated with notable coworkers such as Ju-Il Choi and Jin Ho An, who have also contributed significantly to the field of semiconductor technology. Their teamwork and shared expertise have resulted in groundbreaking advancements and patent applications that benefit the industry.

Conclusion: Jeonggi Jin stands out as a key innovator in the semiconductor sector, with a solid background and a substantial number of patents to his name. His work at Samsung Electronics Co., Ltd. and his collaborations with other talented professionals underscore his impact on the industry. As technology continues to evolve, Jeonggi's contributions will undoubtedly play a vital role in shaping the future of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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