The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2024
Filed:
Jan. 04, 2022
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jeonggi Jin, Seoul, KR;
Gyuho Kang, Cheonan-si, KR;
Unbyoung Kang, Hwaseong-si, KR;
Heewon Kim, Asan-si, KR;
Jumyong Park, Cheonan-si, KR;
Hyunsu Hwang, Siheung-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 24/08 (2013.01); H01L 23/481 (2013.01); H01L 23/5226 (2013.01); H01L 23/53238 (2013.01); H01L 24/05 (2013.01); H01L 2224/02251 (2013.01); H01L 2224/05009 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/08146 (2013.01);
Abstract
A semiconductor chip includes: a semiconductor substrate; a pad insulating layer on the semiconductor substrate; a through electrode which penetrates the semiconductor substrate and the pad insulating layer and includes a conductive plug and a conductive barrier layer surrounding a sidewall of the conductive plug; and a bonding pad which surrounds a sidewall of the through electrode and is spaced apart from the conductive plug with the conductive barrier layer disposed therebetween.