The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Mar. 25, 2020
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jeonggi Jin, Seoul, KR;
Jumyong Park, Yongin-si, KR;
Jinho An, Seoul, KR;
Taehwa Jeong, Hwaseong-si, KR;
Jinho Chun, Seoul, KR;
Juil Choi, Seongnam-si, KR;
Atsushi Fujisaki, Seongnam-si, KR;
Abstract
A semiconductor package includes a semiconductor chip including a chip pad; a lower redistribution structure on the semiconductor chip, the lower redistribution structure including a lower redistribution insulating layer and a lower redistribution pattern electrically connected to the chip pad of the semiconductor chip; a molding layer on at least a portion of the semiconductor chip; and a conductive post in the molding layer, the conductive post having a bottom surface and a top surface, the bottom surface of the conductive post being in contact with the lower redistribution pattern of the lower redistribution structure and the top surface of the conductive post having a concave shape.