Company Filing History:
Years Active: 2017-2024
Title: Jinho An: Innovator in Semiconductor Packaging
Introduction
Jinho An is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His work focuses on innovative designs that enhance the functionality and efficiency of semiconductor devices.
Latest Patents
Among his latest patents, Jinho An has developed a semiconductor package that includes a semiconductor chip with a chip pad. This package features a lower redistribution structure that consists of a lower redistribution insulating layer and a lower redistribution pattern, which is electrically connected to the chip pad. Additionally, the package includes a molding layer and a conductive post that has a concave shape on its top surface, enhancing its performance. Another notable patent involves a semiconductor package that incorporates an interposer with bonding pads and semiconductor devices, designed to improve connectivity and efficiency.
Career Highlights
Jinho An is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His innovative designs have not only contributed to the company's success but have also set new standards in the industry.
Collaborations
Throughout his career, Jinho An has collaborated with talented individuals such as Jeonggi Jin and Jinho Chun. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Jinho An's contributions to semiconductor packaging exemplify his dedication to innovation and excellence. His patents reflect a deep understanding of technology and a commitment to advancing the field.