The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2017

Filed:

Jul. 13, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Jeonggi Jin, Seoul, KR;

Kyu-Ha Lee, Yongin-si, KR;

Jinho Chun, Seoul, KR;

Byunglyul Park, Seoul, KR;

Jinho An, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/11 (2006.01); H01L 21/78 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/09 (2013.01); H01L 21/78 (2013.01); H01L 23/3171 (2013.01); H01L 24/08 (2013.01); H01L 25/117 (2013.01); H01L 25/50 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/0233 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/08059 (2013.01); H01L 2224/08111 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06541 (2013.01);
Abstract

An electronic device includes an upper insulating layer on a substrate. An upper redistribution structure is embedded in the upper insulating layer. The upper redistribution structure includes an upper contact portion, an upper pad portion, and an upper line portion between the upper contact portion and the upper pad portion. A passivation layer is on the upper insulating layer and the upper redistribution structure. An upper opening is configured to pass through the passivation layer and expose the upper pad portion. Vertical thicknesses of the upper pad portion and the upper contact portion are greater than a vertical thickness of the upper line portion.


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