Suwon, South Korea

Taehwa Jeong

This inventor holds 4 USPTO granted patents and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2022-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Taehwa Jeong. Retrieved from https://idiyas.com/inventor/taehwa-jeong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

% Patents Active = 100.0

Average Co-Inventor Count = 6.2

ph-index = 1


Company Filing History:


Years Active: 2022-2025

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4 patents (USPTO):Explore Patents

Title: Taehwa Jeong: Innovator in Semiconductor Technologies

Introduction

Taehwa Jeong, a distinguished inventor based in Suwon-si, South Korea, has made significant contributions to the world of semiconductor technologies. With three patents to his name, Jeong stands out as a key figure in innovation within the electronics industry. His expertise drives advancements in semiconductor packaging that enhance performance and reliability in electronic devices.

Latest Patents

Among his latest inventions, Jeong has developed a couple of notable patents focused on semiconductor packaging. The first patent outlines a semiconductor package that includes a semiconductor chip featuring a chip pad, a lower redistribution structure with an insulating layer, and a conductive post embedded in a molding layer. This design improves connectivity and thermal performance, addressing critical challenges in semiconductor applications.

The second patent describes a semiconductor device comprising a semiconductor chip and a unique redistribution layer structure. This invention showcases an innovative bump pad with intricate structures designed to optimize connections and performance. Both patents reflect Jeong's dedication to enhancing semiconductors' efficiency and reliability.

Career Highlights

Taehwa Jeong is currently employed at Samsung Electronics Co., Ltd., one of the world’s leading technology companies. His work in packaging technologies has been crucial in the development of next-generation electronic devices, reflecting his commitment to pushing the boundaries of innovation in the semiconductor field.

Collaborations

Throughout his career, Jeong has worked alongside notable colleagues such as Jeonggi Jin and Juil Choi. These collaborations have spurred further advancements and fostered an environment of creativity and technical excellence within their projects.

Conclusion

In summary, Taehwa Jeong exemplifies the spirit of innovation in the semiconductor industry with his groundbreaking patents and collaborations. His contributions continue to pave the way for advancements in electronic devices, playing a vital role in the evolution of technology in a rapidly advancing digital age.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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