The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2023
Filed:
Nov. 17, 2020
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Ju-Il Choi, Seongnam-si, KR;
Jumyong Park, Cheonan-si, KR;
Jin Ho An, Seoul, KR;
Chungsun Lee, Asan-si, KR;
Teahwa Jeong, Hwaseong-si, KR;
Jeonggi Jin, Seoul, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 25/0652 (2013.01); H01L 25/105 (2013.01);
Abstract
An interconnection structure includes a dielectric layer, and a wiring pattern in the dielectric layer. The wiring pattern includes a via body, a first pad body that vertically overlaps the via body, and a line body that extends from the first pad body. The via body, the first pad body, and the line body are integrally connected to each other, and a level of a bottom surface of the first pad body is lower than a level of a bottom surface of the line body.