Kawasaki, Japan

Takuma Hasegawa

This inventor holds 3 USPTO granted patents. Top assignees: Tokyo Ohka Kogyo Co., Ltd., Omnivision Technologies, Inc.. Active years: 2012-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takuma Hasegawa. Retrieved from https://idiyas.com/inventor/takuma-hasegawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 66.7

Average Co-Inventor Count = 1.8

ph-index = 2

Forward Citations = 12(Granted Patents)


Location History:

  • Kanagawa, JP (2012)
  • Kawasaki, JP (2016 - 2022)

Company Filing History:


Years Active: 2012-2022

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Takuma Hasegawa: Innovator in Image Sensor Technology

Introduction

Takuma Hasegawa is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of image sensor technology, holding a total of 3 patents. His work focuses on enhancing the performance and efficiency of image sensors, which are crucial in various applications, including photography and video recording.

Latest Patents

One of Hasegawa's latest patents is related to dark current and white pixel devices and methods for lateral overflow image sensors. This patent discloses image sensors designed to reduce dark current and white pixel issues. In one embodiment, each pixel of the image sensor includes a photodiode (PD), a first floating diffusion (FD) coupled to the photodiode through a transfer (TX) transistor, a second floating diffusion (FD) coupled to the FD through a dual floating diffusion (DFD) transistor, and a lateral overflow integrating capacitor (LOFIC) connected between the FD and a variable reference voltage (VCAP). The method for a correlated double sampling (CDS) readout involves exposing a photodiode (PD) to light during an exposure period and increasing the capacitance of the LOFIC by setting the VCAP to a high voltage (H) level during the integration period of the exposure.

Another notable patent involves a bonding method that includes an adhesive layer forming process. In this process, a thermoplastic adhesive is applied to a substrate or a support plate, and an adhesive layer is formed. This is followed by a heating process where the adhesive layer is heated, and finally, a bonding process where the substrate and the support plate are pressed against each other via the heated adhesive layer, effectively bonding them together.

Career Highlights

Throughout his career, Takuma Hasegawa has worked with notable companies such as Tokyo Ohka Kogyo Co., Ltd. and Omnivision Technologies, Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in image sensor technology.

Collaborations

Hasegawa has collaborated with talented individuals in the field, including Yoshihiro Inao and Atsuo Kajima. These collaborations have fostered innovation and have been instrumental in the development of new technologies.

Conclusion

Takuma Hasegawa is a distinguished

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…