The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Jan. 11, 2013
Applicant:
Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi, JP;
Inventors:
Yoshihiro Inao, Kawasaki, JP;
Atsuo Kajima, Kawasaki, JP;
Takuma Hasegawa, Kawasaki, JP;
Koki Tamura, Kawasaki, JP;
Shigeru Yokoi, Kawasaki, JP;
Assignee:
TOKYO OHKA KOGYO CO., LTD., Kawasaki-Shi, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); B32B 43/00 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); H01L 21/02057 (2013.01); H01L 21/31111 (2013.01); H01L 21/31133 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); B32B 38/10 (2013.01); B32B 2307/748 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); Y10T 156/1111 (2015.01); Y10T 156/1158 (2015.01); Y10T 156/1195 (2015.01); Y10T 156/1917 (2015.01); Y10T 156/1994 (2015.01);
Abstract
A bonding method including an adhesive layer forming process in which a thermoplastic adhesive is applied to a substrate or a support plate and an adhesive layer is formed; a heating process in which the adhesive layer that is formed on the substrate or the support plate is heated; and a bonding process in which the substrate and the support plate are pressed against each other via the heated adhesive layer, thereby bonding the substrate and the support plate.