This inventor holds 1 USPTO granted patent. Top assignee: Tokyo Ohka Kogyo Co., Ltd.. Active years: 2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2016
Title: Atsuo Kajima: Innovator in Bonding Technology
Introduction
Atsuo Kajima is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of bonding technology, particularly through his innovative processing methods and apparatus.
Latest Patents
Kajima holds a patent for a processing method and processing apparatus that involves a bonding method. This method includes an adhesive layer forming process where a thermoplastic adhesive is applied to a substrate or a support plate. The process also involves a heating phase where the adhesive layer is heated, followed by a bonding phase where the substrate and support plate are pressed together via the heated adhesive layer, effectively bonding them.
Career Highlights
Atsuo Kajima is associated with Tokyo Ohka Kogyo Co., Ltd., a company known for its advancements in chemical products and materials. His work has been instrumental in enhancing the efficiency and effectiveness of bonding processes in various applications.
Collaborations
Kajima has collaborated with talented coworkers such as Yoshihiro Inao and Takuma Hasegawa, contributing to the innovative environment at Tokyo Ohka Kogyo Co., Ltd.
Conclusion
Atsuo Kajima's contributions to bonding technology through his patent and work at Tokyo Ohka Kogyo Co., Ltd. highlight his role as a significant inventor in the field. His innovative methods continue to influence advancements in processing technologies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile