Tokyo, Japan

Takeshi Segawa

This inventor holds 9 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignees: Lintec Corporation, Shin-Etsu Polymer Co., Ltd., Nisshin Pharma Inc.. Active years: 2008-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takeshi Segawa. Retrieved from https://idiyas.com/inventor/takeshi-segawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9 

% Patents Active = 22.2


Average Co-Inventor Count = 2.9

ph-index = 4

Forward Citations = 39(Granted Patents)


Location History:

  • Saitama, JP (2011 - 2013)
  • Itabashi-ku, JP (2011 - 2013)
  • Tokyo, JP (2008 - 2014)

Company Filing History:


Years Active: 2008-2014

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9 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Takeshi Segawa

Introduction

Takeshi Segawa is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of technology, particularly in the area of chip production and wafer processing. With a total of nine patents to his name, Segawa's work has had a considerable impact on the industry.

Latest Patents

One of Segawa's latest patents is a method for producing a chip with an adhesive applied. This innovative method involves laminating a die bonding adhesive layer and a wafer on a close-contact layer of a fixing jig. The process allows for the complete cutting of the wafer and the die bonding adhesive layer, enabling the chip to be picked up along with the adhesive layer by deforming the close-contact layer of the jig. The jig is designed with a close-contact layer and a jig base that features multiple protrusions, ensuring effective adhesion and support during the production process.

Another notable patent is the method of transporting work and apparatus with a work handover mechanism. This invention ensures that both surfaces of a wafer are securely supported during processing and transportation. The method involves fixing a first jig in close contact with one surface of the wafer, performing processing on the opposite surface, and then transferring the wafer to a second jig. The design includes a close contact layer and a jig main body with supporting projections, allowing for efficient handling and processing of the wafer.

Career Highlights

Throughout his career, Takeshi Segawa has worked with reputable companies such as Lintec Corporation and Shin-Etsu Polymer Co., Ltd. His experience in these organizations has contributed to his expertise in the field of technology and innovation.

Collaborations

Segawa has collaborated with notable coworkers, including Kiyofumi Tanaka and Hironobu Fujimoto. These partnerships have likely enhanced his work and contributed to the development of his innovative patents.

Conclusion

Takeshi Segawa's contributions to the field of technology through his patents and innovative methods have made a significant impact on chip production and wafer processing. His work continues to influence the industry and showcases the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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