Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure

Abstract

A backgrinding machineof a semiconductor wafer W includes: a tableset on the working plane of a mount; a multiple number of holding jigsarranged via check tableson table; a grinding machinefor performing a grinding process of the rear side of semiconductor wafer W held by holding jig; and a washing devicefor ground semiconductor wafers W. Each holding jigis constructed of a concavedepressed on the surface of a base plate, a multiple number of supporting projectionsprojectively arrayed on the bottom surface of concave, a deformable contact film, covering the concave, being supported by the multiple supporting projections, for detachably holding semiconductor wafer W in close contact with it; and an exhaust pathfor conducting air from the concavecovered by contact filmto the outside.