Lintec Corporation

Shin-Etsu Polymer Co., Ltd.

Nisshin Pharma Inc.

Shin-Etsu Polymer

Takeshi Segawa

Kiyofumi Tanaka

Hironobu Fujimoto

Satoshi Odashima

Noriyoshi Hosono

Kenichi Watanabe

Koichi Yamaguchi

Tetsuyuki Utagawa

Yuichi Iwakata

Tsuyoshi Minemura

Takehiko Nishikawa

Hironori Kubota

Chisato Iino

Naofumi Izumi

Atsuko Abe

A method for producing a chip () in which a die bonding adhesive layer () and a wafer () are laminated on a close-contact layer () of a fixing jig (), the chip is formed by completely cutting the wafer and the die bonding adhesive layer and then the chip is picked up together with the die bonding adhesive layer from the fixing jig by deforming the close-contact layer of the fixing jig. In the method the fixing jig is provided with the close-contact layer and a jig base () that is provided with a plurality of protrusions () on one side and a sidewall () at the outer circumference section of the one side. The close-contact layer is laminated on the surface of the jig base provided with the protrusions and is bonded on the upper surface of the sidewall. On the surface of the jig base provided with the protrusions, a partitioned space is formed by the close-contact layer, the protrusions, and the sidewall. The jig base is provided with at least one through hole () penetrating the outside and the partitioned space, and the close-contact layer can be deformed by sucking air from the partitioned space via the through hole of the fixing jig.

Method for producing chip with adhesive applied

When both surfaces of a wafer are sequentially subjected to processing, the wafer is made to be surely supported so that a predetermined processing and transporting can be performed. On one surface of the wafer a first fixing jig () is fixed in close contact. After having performed a predetermined processing to the opposite surface of the wafer, a second fixing jig () is fixed in close contact with the opposite surface of the wafer. The first fixing jig () is removed and the wafer is handed over to the second fixing jig (). Each of the fixing jigs is made up of a jig main body (), and a close contact layer () which is disposed on one surface thereof. The jig main body has a plurality of supporting projections () to support the close contact layer, and a side wall (). The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space () enclosed by the side wall, between the close contact layer and the jig main body. A ventilation hole () to be communicated with the partitioned space is formed, and the close contact layer is deformed by suction of the air within the partitioned space. At the time of removing, the close contact layer of the first fixing jig is deformed, and both the fixing jigs are relatively moved in a direction away from each other.

Method of transporting work and apparatus with work handover mechanism

A fixing jig is made up of a plate-like jig main body () and a close contact layer () which detachably holds a work (W) in close contact therewith. The jig main body has: on one surface thereof a plurality of supporting projections () to support the close contact layer; and also has, along an outer peripheral portion of said one surface, a side wall () which is of substantially the same height as the supporting projections. The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space () between the close contact layer and the jig main body. By sucking the air within the partitioned space via a ventilation hole () formed in the jig main body, the close contact layer is deformed. The work is thus surely supported and fixed also in performing a processing in which a force is applied to the work. The jig main body () has formed therein a suction hole () which opens into an outer surface on the side of the close contact layer () but which is not communicated with the partitioned space (). A through hole () in communication with the suction hole () is formed in the close contact layer (). A suction force is applied to the work W by evacuation of the suction hole ().

Fixing jig and method of processing work

A semiconductor wafer processing tape sticking apparatus is provided and is capable of sticking a semiconductor wafer processing tape to a semiconductor wafer under the optimum conditions based on the processing data that has been written to a data carrier member and that has been read from the data carrier member without accessing the host computer unlike a conventional method. The semiconductor wafer processing tape sticking apparatus includes: a feeding apparatus provided with a feeding shaft to which a semiconductor wafer processing tape winding body can be detachably attached; a tape data read/write device for reading and writing the processing data that has been written to a data carrier member of the semiconductor wafer processing tape winding body; and a tape sticking apparatus for sticking a semiconductor wafer processing tape that has been fed out from the feeding apparatus to the semiconductor wafer based on the processing data that has been read by the tape data read/write device.

Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body

A backgrinding machineof a semiconductor wafer W includes: a tableset on the working plane of a mount; a multiple number of holding jigsarranged via check tableson table; a grinding machinefor performing a grinding process of the rear side of semiconductor wafer W held by holding jig; and a washing devicefor ground semiconductor wafers W. Each holding jigis constructed of a concavedepressed on the surface of a base plate, a multiple number of supporting projectionsprojectively arrayed on the bottom surface of concave, a deformable contact film, covering the concave, being supported by the multiple supporting projections, for detachably holding semiconductor wafer W in close contact with it; and an exhaust pathfor conducting air from the concavecovered by contact filmto the outside.

Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure

It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jigis composed of a jig baseand an contact layer. A concave partis formed on one side of the jig base. The concave partis sectioned into small chambersby a partitionhaving a height almost equivalent to that of a sidewall. The contact layeris disposed on the upper edge of the sidewalland the partitionfor covering the concave part. A through holethat is communicated with the outside is formed in each small chamber

Fixed jig, chip pickup method and chip pickup apparatus

A structure formed of a resin material with a built-in recording medium comprising at least a means for rewriting visible information with a laser light in a non-contact manner; a laminate comprising the structure and a method for recording in the non-contact manner using the structure or the laminate are disclosed. The recording and erasing of information in the recording medium can be conducted by irradiation with a laser light from outside. The laser light transmittance in a used wave length range and the visible light transmittance through a portion of the structure from a surface on which the laser light is irradiated to the recording medium are in a specified range. Surface destruction of the recording medium due to laser light on rewriting visible information, decrease in durability during cleaning, damages on the recording medium during transportation and deterioration in the color developing property due to light can be overcome.

Structure with a built-in recording medium, a laminate comprising the structure and method for recording in non-contact manner using the structure and the laminate

A water-soluble composition comprising (A) coenzyme Qof 5-40% by weight, (B) monoester of polyglycerol with average polymerization degree of 10 and fatty acid with 18 carbon atoms of 5-30% by weight, (C) mono-, di-, tri- or penta-ester of polyglycerol with average polymerization degree of 3-6 and fatty acid with 18 carbon atoms of 1-18% by weight, and (D) water, wherein its average particle diameter is 110 nm or smaller. It is superior in acid resistance, salt-resistance and heat resistance, and further enables to maintain the good water-soluble state being blended to medicines, foods and beverages, cosmetics, feeds, additives usually employed therein.

Growing community of inventors

Tokyo, Japan

Takeshi Segawa