Gunma, Japan

Takeshi Miyakawa

This inventor holds 36 USPTO granted patents and 1 published patent application, plus 1 CIPO patent and 3 EPO patents, primarily in Heat Dissipation Technology. Top assignees: Denki Kagaku Kogyo Kabushiki Kaisha, Denka Company Limited, University of Yamanashi. Active years: 1995-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takeshi Miyakawa. Retrieved from https://idiyas.com/inventor/takeshi-miyakawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 36 

% Patents Active = 91.7



Average Co-Inventor Count = 3.1

ph-index = 5

Forward Citations = 64(Granted Patents)


Location History:

  • Machida, JP (1995 - 1999)
  • Gunma, JP (2002 - 2013)
  • Isezaki, JP (2006 - 2013)
  • Shibukawa, JP (2013 - 2014)
  • Omuta, JP (2018 - 2023)

Company Filing History:


Years Active: 1995-2023

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Areas of Expertise:
Heat Dissipation Component
Aluminum Composite
Silicon Carbide
Ceramic Circuit Board
Electrically Conductive Sheet
Conductive Resin Composition
Electronic Component Container
Packaging Container
36 patents (USPTO):Explore Patents

Title: Innovations by Takeshi Miyakawa: Advancements in Metal-Base Substrates and Circuit Boards

Introduction

Takeshi Miyakawa, a distinguished inventor based in Gunma, Japan, has made significant contributions to the field of electronics through his innovative patent developments. With a portfolio of 20 patents, including key techniques for manufacturing metal-base substrates and circuit boards, Miyakawa continues to push the boundaries of electronic manufacturing processes.

Latest Patents

Among his most recent inventions are a method of manufacturing a metal-base substrate and a method of manufacturing a circuit board. The patented method for manufacturing a metal-base substrate involves creating an insulative adhesive layer and a conductor layer atop a metal-based material. This sophisticated process consists of several intricate steps: dispersing a disperse phase in an adhesive medium containing a wetting dispersant, laminating the adhesive onto conductor foil, and curing to achieve a composite state. This innovative manufacturing technique enhances the durability and performance of metal base substrates in electronic applications.

Additionally, the invention of a metal base circuit board introduces a novel function of light reflection, augmenting the conventional features of printed circuit boards that are primarily designed for mounting electronic components. This circuit board comprises an arrangement of circuits on a metal plate, separated by an insulation layer, with a white film applied at least on the insulation layer to improve functionality.

Career Highlights

Takeshi Miyakawa's career has been marked by his tenure at Denki Kagaku Kogyo Kabushiki Kaisha, a renowned company specializing in electronic materials and components. His work has established him as a key figure within the organization, contributing to critical advancements that shape the industry.

Collaborations

Throughout his career, Miyakawa has collaborated with other notable professionals, including Mikio Shimizu and Masanori Higano, showcasing his ability to work effectively within a team to foster innovation. These collaborations have enabled the sharing of ideas and techniques that further enhance their respective contributions to the field.

Conclusion

Takeshi Miyakawa exemplifies the spirit of innovation with his significant contributions to the electronics industry. His patented inventions, particularly in the manufacturing of metal-base substrates and circuit boards, underline his commitment to advancing technology. Through ongoing collaborations and his work at Denki Kagaku Kogyo Kabushiki Kaisha, Miyakawa is poised to continue making impactful contributions to the realm of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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