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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10869413 B1

PDFFull Text
Date of Patent:
Dec. 15, 2020

Filed:

Jul. 03, 2015

Heat-dissipating component and method for manufacturing same

Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Takeshi Miyakawa, Omuta, JP;

Motonori Kino, Omuta, JP;

Assignee:

DENKA COMPANY LIMITED, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Jeffrey A Vonch

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); C22C 47/08 (2006.01); C22C 49/06 (2006.01); C22C 49/14 (2006.01); C04B 35/565 (2006.01); H05K 7/20 (2006.01); B22D 19/14 (2006.01); B22D 19/00 (2006.01); C22C 47/06 (2006.01); B22D 21/00 (2006.01); C04B 41/51 (2006.01); C09K 5/14 (2006.01); C22C 21/02 (2006.01); C22C 21/08 (2006.01); C22C 47/12 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); B22D 19/00 (2013.01); B22D 19/14 (2013.01); B22D 21/007 (2013.01); C04B 35/565 (2013.01); C04B 41/5155 (2013.01); C09K 5/14 (2013.01); C22C 21/02 (2013.01); C22C 21/08 (2013.01); C22C 47/06 (2013.01); C22C 47/08 (2013.01); C22C 49/06 (2013.01); C22C 49/14 (2013.01); H01L 21/4871 (2013.01); H01L 23/3733 (2013.01); C22C 47/12 (2013.01); H01L 23/4006 (2013.01); Y10T 428/12361 (2015.01);
Abstract

A heat-dissipating component, and a method for manufacturing the same, the component provided with a composited portion including a plate-shaped molded body containing silicon carbide, and hole-formation portions formed in a peripheral edge portion of the composited portion; through-holes being formed in the hole formation sections; the hole-formation portions containing inorganic fibers; the molded body and the inorganic fibers being impregnated with an aluminum-containing metal; and the hole-formation portions forming a part of the outer peripheral surface of the heat-dissipating component.

Find Patent Forward Citations

Miyakawa, Takeshi. (2020). Heat-dissipating component and method for manufacturing same (U.S. Patent No. 10869413). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10869413

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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