The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2019
Filed:
Jul. 03, 2015
Applicant:
Denka Company Limited, Tokyo, JP;
Inventors:
Assignee:
DENKA COMPANY LIMITED, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 7/00 (2006.01); C22C 26/00 (2006.01); C22C 1/05 (2006.01); C22C 21/02 (2006.01); C22C 45/04 (2006.01); B22F 1/00 (2006.01);
U.S. Cl.
CPC ...
C22C 26/00 (2013.01); C22C 1/05 (2013.01); C22C 21/02 (2013.01); C22C 45/04 (2013.01); B22F 1/0003 (2013.01); B22F 1/0059 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); Y10T 428/12056 (2015.01); Y10T 428/12063 (2015.01); Y10T 428/12069 (2015.01); Y10T 428/12076 (2015.01); Y10T 428/12083 (2015.01); Y10T 428/12889 (2015.01); Y10T 428/12944 (2015.01);
Abstract
A composite is obtained by press-molding a mixed powder comprising 20-50 vol % of a metal powder and 50-80 vol % of a diamond powder for which a first peak in a volumetric distribution of particle size lies at 5-25 μm, and a second peak lies at 55-195 μm, and a ratio between the area of a volumetric distribution of particle sizes of 1-35 μm and the area of a volumetric distribution of particle sizes of 45-205 μm is from 1:9 to 4:6, thereby obtaining a composite having a high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, which is easy to mold into a prescribed shape.