The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 2021

Filed:

Jul. 31, 2015
Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Akimasa Yuasa, Omuta, JP;

Takeshi Miyakawa, Omuta, JP;

Daisuke Goto, Omuta, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 3/26 (2006.01); C04B 35/565 (2006.01); C04B 41/88 (2006.01); C04B 38/00 (2006.01); B22D 19/00 (2006.01); C04B 41/00 (2006.01); C04B 41/51 (2006.01); B22D 19/02 (2006.01); C04B 35/573 (2006.01); C04B 35/63 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); C04B 35/645 (2006.01); B22D 19/14 (2006.01); C22C 1/10 (2006.01); C04B 111/00 (2006.01);
U.S. Cl.
CPC ...
C04B 35/565 (2013.01); B22D 19/00 (2013.01); B22D 19/02 (2013.01); B22D 19/14 (2013.01); C04B 35/573 (2013.01); C04B 35/6316 (2013.01); C04B 35/645 (2013.01); C04B 38/00 (2013.01); C04B 38/0032 (2013.01); C04B 41/009 (2013.01); C04B 41/5155 (2013.01); C04B 41/88 (2013.01); C22C 1/1068 (2013.01); H01L 21/4871 (2013.01); H01L 23/3731 (2013.01); H01L 23/3736 (2013.01); C04B 2111/00844 (2013.01); C04B 2111/00931 (2013.01); C04B 2235/3418 (2013.01); C04B 2235/3826 (2013.01); C04B 2235/401 (2013.01); C04B 2235/402 (2013.01); C04B 2235/428 (2013.01); C04B 2235/5472 (2013.01); C04B 2235/6027 (2013.01); C04B 2235/616 (2013.01); C04B 2235/783 (2013.01); C04B 2235/786 (2013.01); C04B 2235/9607 (2013.01); C22C 1/10 (2013.01); C22C 1/1036 (2013.01); C22C 2001/1021 (2013.01); Y10T 428/12007 (2015.01);
Abstract

Provided are an aluminum-silicon-carbide composite having high thermal conductivity, low thermal expansion, and low specific gravity and a method for producing the composite. Provided is an aluminum-silicon-carbide composite formed by impregnating a porous silicon carbide molded body with an aluminum alloy. The ratio of silicon carbide in the composite is 60 vol % or more, and the composite contains 60-75 mass % of silicon carbide having a particle diameter of 80 μm or more and 800 μm or less, 20-30 mass % of silicon carbide having a particle diameter of 8 μm or more and less than 80 μm, and 5-10 mass % of silicon carbide having a particle diameter of less than 8 μm.


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