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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10539379 B1

PDFFull Text
Date of Patent:
Jan. 21, 2020

Filed:

Sep. 01, 2015

Heat dissipation component for semiconductor element

Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Yosuke Ishihara, Omuta, JP;

Takeshi Miyakawa, Omuta, JP;

Kazunori Koyanagi, Omuta, JP;

Assignee:

DENKA COMPANY LIMITED, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Seth Dumbris

Int. Cl.
CPC ...
B22F 7/02 (2006.01); F28F 21/02 (2006.01); C22C 26/00 (2006.01); C22C 47/12 (2006.01); H01L 23/373 (2006.01); C22C 21/02 (2006.01); F28F 21/08 (2006.01); H01L 21/48 (2006.01); B22F 7/06 (2006.01); C25D 5/12 (2006.01); C22C 49/06 (2006.01); C25D 5/44 (2006.01); C23C 18/32 (2006.01); C23C 18/42 (2006.01);
U.S. Cl.
CPC ...
F28F 21/02 (2013.01); B22F 7/06 (2013.01); C22C 21/02 (2013.01); C22C 26/00 (2013.01); C22C 47/12 (2013.01); C25D 5/12 (2013.01); F28F 21/084 (2013.01); F28F 21/089 (2013.01); H01L 21/4871 (2013.01); H01L 23/373 (2013.01); H01L 23/3732 (2013.01); H01L 23/3736 (2013.01); C22C 49/06 (2013.01); C23C 18/32 (2013.01); C23C 18/42 (2013.01); C25D 5/44 (2013.01); F28F 2255/06 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/12056 (2015.01); Y10T 428/12069 (2015.01);
Abstract

A heat dissipation component for a semiconductor element includes: a composite part containing 50-80 vol % diamond powder with the remainder having metal including aluminum, the diamond powder having a particle diameter volume distribution first peak at 5-25 μm and a second peak at 55-195 μm. A ratio between a volume distribution area at particle diameters of 1-35 μm and a volume distribution area at particle diameters of 45-205 μm is 1:9 to 4:6; surface layers on both composite part principal surfaces, each of the surface layers containing 80 vol % or more metal including aluminum and having a film thickness of 0.03-0.2 mm; and a crystalline Ni layer and an Au layer on at least one of the surface layers, the crystalline Ni layer having a film thickness of 0.5-6.5 μm, and the Au layer having a film thickness of 0.05 μm or larger.

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