Omuta, Japan

Kazunori Koyanagi

USPTO Granted Patents = 3 

Average Co-Inventor Count = 3.8

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2019-2020

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3 patents (USPTO):Explore Patents

Title: Kazunori Koyanagi: Innovator in Aluminum-Diamond-Based Composites

Introduction

Kazunori Koyanagi is a notable inventor based in Omuta, Japan. He has made significant contributions to the field of materials science, particularly in the development of aluminum-diamond-based composites. With a total of 3 patents to his name, Koyanagi's work focuses on enhancing the performance and efficiency of heat dissipation components.

Latest Patents

Koyanagi's latest patents include an aluminum-diamond-based composite and a heat dissipation component for semiconductor elements. The aluminum-diamond-based composite is designed to be processed with high dimensional accuracy. It features a flat-plate shape coated with a surface layer that has an average film thickness of 0.01-0.2 mm, containing not less than 80 volume % of a metal that includes aluminum. The heat dissipation component for semiconductor elements consists of a composite part containing 50-80 vol % diamond powder, with the remainder being a metal that includes aluminum. This innovative design ensures effective heat management in semiconductor applications.

Career Highlights

Koyanagi is currently employed at Denka Company Limited, where he continues to push the boundaries of material innovation. His work has been instrumental in developing advanced materials that meet the demands of modern technology.

Collaborations

Koyanagi collaborates with talented individuals such as Yosuke Ishihara and Takeshi Miyakawa. Their combined expertise contributes to the success of their projects and the advancement of their field.

Conclusion

Kazunori Koyanagi's contributions to the field of materials science, particularly through his patents on aluminum-diamond-based composites, highlight his innovative spirit and dedication to improving technology. His work continues to influence the development of efficient heat dissipation solutions in various applications.

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