The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

Nov. 24, 2017
Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Yosuke Ishihara, Omuta, JP;

Takeshi Miyakawa, Omuta, JP;

Hiroaki Ota, Omuta, JP;

Hideo Tsukamoto, Omuta, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); C23C 18/32 (2006.01); C25D 7/12 (2006.01); C22C 26/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); C22C 26/00 (2013.01); C23C 18/32 (2013.01); C25D 7/12 (2013.01);
Abstract

A sheet-shaped aluminum-diamond composite containing a prescribed amount of a diamond powder wherein a first and second peak in a volumetric distribution of particle sizes occurs at 5-25 μm and 55-195 μm, and a ratio between an area of a volumetric distribution of particle sizes of 1-35 μm and 45-205 μm is from 1:9 to 4:6, the composite including an aluminum-containing metal as the balance, wherein the composite is covered, on both main surfaces, with a surface layer having prescribed film thicknesses and containing 80 vol % or more of an aluminum-containing metal, two or more Ni-containing layers are formed on at least the surface layer, the Ni-containing layers being such that a first and second layer from the surface layer side are amorphous Ni alloy layers having prescribed thicknesses, and an Au layer having a prescribed thickness is formed as an outermost layer.


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