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For the Inventor, By the Inventor

Osaka, Japan

Takehisa Kajikawa

This inventor holds 7 USPTO granted patents. Top assignee: Murata Manufacturing Co., Ltd.. Active years: 1999-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takehisa Kajikawa. Retrieved from https://idiyas.com/inventor/takehisa-kajikawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7

% Patents Active = 71.4

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 19(Granted Patents)


Location History:

  • Osaka, JP (1999 - 2001)
  • Nishinomiya, JP (2005 - 2006)

Company Filing History:

goldMedal7 out of 13,796 
 
Murata Manufacturing Co., Ltd.
 patents

Years Active: 1999-2006

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7 patents (USPTO):Explore Patents
1. 7022554 - Method for fabricating circuit module (2006-04-04),
2. 6911882 - High-frequency module, transmitter-receiver, and method of adjusting characteristic of the high-frequency module (2005-06-28),
3. 6285269 - High-frequency semiconductor device having microwave transmission line being formed by a gate electrode source electrode and a dielectric layer in between (2001-09-04),
4. 6172572 - Dielectric resonator, dielectric filter, dielectric duplexer, and oscillator (2001-01-09),
5. 6169301 - Planar dielectric integrated circuit (2001-01-02),
6. 6163688 - Oscillator and communications device (2000-12-19),
7. 5872485 - Dielectric line waveguide which forms electronic circuits (1999-02-16),

Title: Takehisa Kajikawa: Innovator in Circuit Module Fabrication

Introduction

Takehisa Kajikawa is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of circuit module fabrication, holding a total of 7 patents. His innovative methods and designs have advanced the technology used in high-frequency modules and circuit components.

Latest Patents

Kajikawa's latest patents include a method for fabricating a circuit module. This method involves filling the gap between a chip component and a substrate with resin, utilizing simplified equipment to minimize the undesired spread of resin. The resin is supplied between the sidewall of a dispenser needle and the sidewall of the chip component, allowing capillary action to form a resin pool that fills the gap spontaneously.

Another notable patent is for a high-frequency module, which includes a dielectric plate with a resonator and a cover. A hole in the cover allows a laser beam for laser trimming to pass through. The design ensures that electromagnetic waves in a usable frequency band are cut off in the hole, allowing for precise adjustments to the electrical characteristics of the module.

Career Highlights

Kajikawa is currently employed at Murata Manufacturing Co., Ltd., a leading company in the electronics industry. His work has been instrumental in developing advanced technologies that enhance the performance and reliability of electronic devices.

Collaborations

Throughout his career, Kajikawa has collaborated with notable colleagues, including Koichi Sakamoto and Sadao Yamashita. These partnerships have fostered innovation and contributed to the success of various projects within the company.

Conclusion

Takehisa Kajikawa's contributions to circuit module fabrication and high-frequency technology have established him as a key figure in the field. His innovative patents and collaborative efforts continue to influence advancements in electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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