The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 16, 1999

Filed:

Jul. 28, 1997
Applicant:
Inventors:

Yohei Ishikawa, Kyoto, JP;

Koichi Sakamoto, Otsu, JP;

Sadao Yamashita, Kyoto, JP;

Takehisa Kajikawa, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F / ; H04B / ; H03B / ; H01P / ;
U.S. Cl.
CPC ...
330286 ; 3311 / ; 333247 ; 333250 ; 455325 ;
Abstract

An amplifying circuit is formed by a combination of a dielectric line waveguide and a semiconductor device. Two electrically conductive plates are provided substantially parallel to each other. Two dielectric strips are disposed between the two conductive plates, and a dielectric plate is further inserted between the dielectric strips. Ground conductors are formed on the dielectric plate. The ground conductors have an area which equals an amount required for blocking a RF signal propagating in the dielectric line waveguide. A slot line is formed between the ground conductors in a position intermediate opposed sides of the dielectric strips. Line-switching conductor patterns are provided at both sides of the ends of the slot line. A field-effect transistor is mounted on the slot line such that it bridges over the slot line. Accordingly, losses and distortion of an RF signal, which would occur in an input/output circuit, are suppressed, and the generation of parasitic coupling is eliminated. Further, the dielectric line waveguide is miniaturized free from an external circuit, and accordingly, the manufacturing cost is reduced as well.


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