Takashi Okamura

USPTO Granted Patents = 19 (Patent Applications = 10)

Average Co-Inventor Count = 1.9

ph-index = 4

Forward Citations = 31(Granted Patents)

Location History:

Kokubunji, JP (2010 - 2011)
Ota-ku, JP (2013 - 2014)
Hachioji, JP (2007 - 2017)
Tokyo, JP (2015 - 2024)

Company Filing History:

Olympus Imaging Corporation

patents

Years Active: 2007-2025

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19 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12424494 - Processing method of wafer (2025-09-23),

2. 12097633 - Cutting method (2024-09-24),

3. 11935738 - Method of processing a wafer (2024-03-19),

4. 11396109 - Processing apparatus (2022-07-26),

5. 10879122 - Wafer processing method (2020-12-29),

6. 10763390 - Optical device wafer processing method (2020-09-01),

7. 9551881 - Retention mechanism, driving apparatus, and blur correction apparatus (2017-01-24),

8. 9488850 - Retention mechanism, driving apparatus, and blur correction apparatus (2016-11-08),

9. 9332184 - Image-shake correction apparatus and imaging apparatus incorporating the same (2016-05-03),

10. 9235061 - Retention mechanism, driving apparatus, and blur correction apparatus (2016-01-12),

11. 9202980 - Light emitting chip (2015-12-01),

12. 8673695 - Sapphire wafer dividing method (2014-03-18),

13. 8518730 - Sapphire wafer dividing method (2013-08-27),

14. 8369698 - Image blur correction apparatus and camera (2013-02-05),

15. 8026972 - Picture-taking lens unit (2011-09-27),

Certainly! Here is an article about inventor Takashi Okamura:

Title: Innovator Spotlight: Takashi Okamura

Introduction: Takashi Okamura, a prolific inventor hailing from Hachioji, Japan, is renowned for his groundbreaking work in the field of processing apparatus and wafer processing methods. With an impressive portfolio of 16 patents, Okamura continues to push boundaries and revolutionize the industry with his innovative solutions.

Latest Patents: One of Okamura's latest patents includes a cutting-edge processing apparatus equipped with a cutting blade that measures edge projection amounts, ensuring precision and efficiency in workpiece cutting. Another notable invention is a wafer processing method that involves thermocompression bonding to divide wafers into individual device chips with utmost accuracy.

Career Highlights: Takashi Okamura has demonstrated his exceptional talent and expertise while working at reputable companies such as Olympus Corporation and Disco Corporation. His contributions have not only enhanced the efficiency of production processes but have also set new standards for quality and precision in the industry.

Collaborations: Throughout his career, Okamura has collaborated with esteemed professionals such as Shuichi Yoshida and Naoyuki Shibata. Together, they have pooled their knowledge and skills to drive innovation and bring cutting-edge technologies to life.

Conclusion: In conclusion, Takashi Okamura stands as a visionary inventor whose relentless pursuit of excellence has led to significant advancements in processing apparatus and wafer processing methods. His passion for innovation and commitment to excellence continue to inspire the industry, shaping the future of technology in remarkable ways.

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