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For the Inventor, By the Inventor

Hachioji, Japan

Takashi Okamura

This inventor holds 20 USPTO granted patents and 10 published patent applications, primarily in Wafer Processing. Top assignees: Disco Corporation, Olympus Corporation, Olympus Imaging Corporation. Active years: 2007-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takashi Okamura. Retrieved from https://idiyas.com/inventor/takashi-okamura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 20 

% Patents Active = 55.0

Average Co-Inventor Count = 1.9

ph-index = 4

Forward Citations = 32(Granted Patents)


Location History:

  • Kokubunji, JP (2010 - 2011)
  • Ota-ku, JP (2013 - 2014)
  • Hachioji, JP (2007 - 2017)
  • Tokyo, JP (2015 - 2024)

Company Filing History:

goldMedal10 out of 1,665 
 
Disco Corporation
 patents
silverMedal7 out of 8,307 
 
Olympus Corporation
 patents
bronzeMedal3 out of 727 
 
Olympus Imaging Corporation
 patents

Years Active: 2007-2026

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Areas of Expertise:
Wafer Processing
Optical Devices
Image Stabilization
Sapphire Wafer
Cutting Methods
Blur Correction
Driving Apparatus
Light Emitting Chip
Picture-Taking Lens
Ultrasonic Motor
Image Correction
Processing Apparatus
20 patents (USPTO):Explore Patents
1. 12752375 - Processing apparatus (2026-10-06),
2. 12424494 - Processing method of wafer (2025-09-23),
3. 12097633 - Cutting method (2024-09-24),
4. 11935738 - Method of processing a wafer (2024-03-19),
5. 11396109 - Processing apparatus (2022-07-26),
6. 10879122 - Wafer processing method (2020-12-29),
7. 10763390 - Optical device wafer processing method (2020-09-01),
8. 9551881 - Retention mechanism, driving apparatus, and blur correction apparatus (2017-01-24),
9. 9488850 - Retention mechanism, driving apparatus, and blur correction apparatus (2016-11-08),
10. 9332184 - Image-shake correction apparatus and imaging apparatus incorporating the same (2016-05-03),
11. 9235061 - Retention mechanism, driving apparatus, and blur correction apparatus (2016-01-12),
12. 9202980 - Light emitting chip (2015-12-01),
13. 8673695 - Sapphire wafer dividing method (2014-03-18),
14. 8518730 - Sapphire wafer dividing method (2013-08-27),
15. 8369698 - Image blur correction apparatus and camera (2013-02-05),

Certainly! Here is an article about inventor Takashi Okamura:

Title: Innovator Spotlight: Takashi Okamura

Introduction: Takashi Okamura, a prolific inventor hailing from Hachioji, Japan, is renowned for his groundbreaking work in the field of processing apparatus and wafer processing methods. With an impressive portfolio of 16 patents, Okamura continues to push boundaries and revolutionize the industry with his innovative solutions.

Latest Patents: One of Okamura's latest patents includes a cutting-edge processing apparatus equipped with a cutting blade that measures edge projection amounts, ensuring precision and efficiency in workpiece cutting. Another notable invention is a wafer processing method that involves thermocompression bonding to divide wafers into individual device chips with utmost accuracy.

Career Highlights: Takashi Okamura has demonstrated his exceptional talent and expertise while working at reputable companies such as Olympus Corporation and Disco Corporation. His contributions have not only enhanced the efficiency of production processes but have also set new standards for quality and precision in the industry.

Collaborations: Throughout his career, Okamura has collaborated with esteemed professionals such as Shuichi Yoshida and Naoyuki Shibata. Together, they have pooled their knowledge and skills to drive innovation and bring cutting-edge technologies to life.

Conclusion: In conclusion, Takashi Okamura stands as a visionary inventor whose relentless pursuit of excellence has led to significant advancements in processing apparatus and wafer processing methods. His passion for innovation and commitment to excellence continue to inspire the industry, shaping the future of technology in remarkable ways.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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