Disco Corporation

Olympus Corporation

Olympus Imaging Corporation

Takashi Okamura

Shigenori Harada

Shuichi Yoshida

Naoyuki Shibata

Koji Kato

Hitoshi Hoshino

Akira Futami

Sumio Kawai

Yasuo Asakura

Akihiro Kubota

Jinyan Zhao

Takafumi Omori

Masanori Kishi

Toshikatsu Shiozaki

Hiroumi Ueno

Yuji Nitta

Tomoharu Takita

Takeshi Abe

There is provided a processing method of a wafer for processing the wafer that includes, on a front surface side, a device region in which a device is formed in each of plural regions marked out by plural planned dividing lines and includes a recess part on the back surface side and includes an annular reinforcing part at a peripheral part. The processing method of a wafer includes a holding step of holding the bottom surface of the recess part, a cutting step of cutting the wafer along the planned dividing lines by a cutting blade to divide the device region into plural device chips and form grooves on the front surface side of the reinforcing part, and a dividing step of dividing the reinforcing part along the planned dividing lines with the grooves being the points of origin by giving an external force to the reinforcing part.

Processing method of wafer

Provided is a cutting method of cutting a workpiece by using a cutting apparatus including a chuck table configured to hold the workpiece and a cutting unit having a cutting blade configured to cut the workpiece held by the chuck table and an ultrasonic vibrator configured to ultrasonically vibrate the cutting blade in a radial direction of the cutting blade. The cutting method includes a holding step of holding the workpiece by the chuck table, and a cutting step of performing ultrasonic cutting that cuts the workpiece by the cutting blade vibrated ultrasonically and normal cutting that cuts the workpiece by the cutting blade not vibrated ultrasonically on the same cutting line of a plurality of cutting lines set on the workpiece.

Cutting method

Edge trimming is performed on a wafer while a cleaning liquid is supplied to the center of a face side of the wafer and the wafer is rotated to form a film of the cleaning liquid that covers the face side of the wafer. The film of the cleaning liquid prevents the face side of the wafer from being dried, lowering the probability that swarf will be introduced into devices on the face side of the wafer. In addition, the consumption of the cleaning liquid can be reduced compared with a step of performing edge trimming on the wafer while supplying a curtain of cleaning liquid to the entire face side of the wafer.

Method of processing a wafer

A processing apparatus includes a cutting blade mounted on a spindle, the cutting blade having a cutting edge for cutting a workpiece held on a holding table, a measuring portion for measuring an edge projection amount of the cutting edge at a predetermined frequency, and a data processing portion. The data processing portion includes a lower limit recording portion for recording a lower limit of the edge projection amount of the cutting edge as an allowable limit for use of the cutting blade, a storing portion for storing blade information including the edge projection amount measured by the measuring portion and a cutting distance traveled by the cutting blade at the time of measurement of the edge projection amount.

Processing apparatus

A wafer processing method includes: a wafer providing step of providing a wafer by placing a thermoplastic polymer sheet on an upper surface of a substrate on which the wafer is supported and positioning a back surface of the wafer on an upper surface of the polymer sheet; a sheet thermocompression bonding step of evacuating an enclosing environment in which the wafer is provided through the polymer sheet on the substrate, heating the polymer sheet, and pressing the wafer toward the polymer sheet to pressure-bond the wafer through the polymer sheet to the substrate; and a dividing step of positioning a cutting blade on the front surface of the wafer and cutting the wafer along the division lines to divide the wafer into individual device chips.

Wafer processing method

An optical device wafer processing method for dividing an optical device wafer along a plurality of division lines to obtain a plurality of individual device chips includes applying a laser beam to a wafer substrate along each division line to thereby form a laser processed groove along each division line, and next forming a V groove along each laser processed groove on the optical device wafer by using a cutting blade having a V-shaped tip in the condition where each laser processed groove is removed by the cutting blade. A crack is formed so as to extend from the bottom of each laser processed groove due to a load applied from the cutting blade, thereby dividing the optical device wafer into the individual device chips. The depth of each laser processed groove is set smaller than the depth of cut by the cutting blade.

Optical device wafer processing method

A retention mechanism includes a fixed part including a magnet, and a movable part opposed to the fixed part. A plurality of rolling elements are provided between the fixed part and the movable part, and the movable part is movable in a plane direction. A magnetic material which forms, in combination with the magnet, a magnetic spring is provided on the movable part. The magnetic spring generates a magnetic attraction force which attracts the movable part to the fixed part. The magnetic material is extended along a direction in which magnetic poles of the magnet are arrayed.

Retention mechanism, driving apparatus, and blur correction apparatus

The image-shake correction apparatusof the invention comprises a base partincluding a permanent magnetand a moving parthaving a coillocated in a position opposite to the permanent magnet, wherein the permanent magnetand coilform together a voice coil motor, and the permanent magnetincludes cutoutsand

Image-shake correction apparatus and imaging apparatus incorporating the same

A retention mechanism according to an embodiment includes a fixed part including a magnet, and a movable part opposed to the fixed part. A plurality of rolling elements are provided between the fixed part and the movable part, and the movable part is movable in a plane direction. A magnetic material which forms, in combination with the magnet, a magnetic spring is provided on the movable part. The magnetic spring generates a magnetic attraction force which attracts the movable part to the fixed part. The magnetic material is extended along a direction in which magnetic poles of the magnet are arrayed.

A light emitting chip of the present invention includes a device chip having a sapphire substrate and a light emitting layer formed over the front surface of the sapphire substrate and a transparent member bonded to the back surface of the sapphire substrate by a resin transmissive to emitted light from the light emitting layer. The transparent member is transmissive to the emitted light from the light emitting layer. A groove is formed in an abutting surface of the transparent member against the device chip in such a manner as to be exposed to the side surface and the abutting surface of the transparent member. The groove width of the groove is smaller than the length of one side of the device chip.

Light emitting chip

A sapphire wafer dividing method including a modified layer forming step of forming a plurality of modified layers inside a sapphire wafer along a plurality of crossing division lines formed on the front side where a light emitting layer is formed, and a chamfering and dividing step of forming a plurality of cut grooves on the back side of the sapphire wafer along the division lines, thereby dividing the sapphire wafer into individual light emitting devices along the modified layers as a division start point, wherein the corners of the back side of each light emitting device are chamfered by the formation of the cut grooves in the chamfering and dividing step.

Sapphire wafer dividing method

A sapphire wafer dividing method including a cut groove forming step of forming a plurality of cut grooves on the back side of a sapphire wafer along a plurality of crossing division lines formed on the front side where a light emitting layer is formed, a modified layer forming step of forming a plurality of modified layers inside the sapphire wafer along the division lines, and a dividing step of dividing the sapphire wafer into individual light emitting devices along the modified layers as a division start point, thereby chamfering the corners of the back side of each light emitting device owing to the formation of the cut grooves in the cut groove forming step.

The invention provides an image blur correction apparatus including: a tabular base portion; a movable portion that holds an image pickup device and that is movable with respect to the base portion; and a voice coil motor that has a permanent magnet arranged on a face of the base portion that faces the movable portion, and a coil arranged in a region of the movable portion facing the permanent magnet, and that generates a force that moves the movable portion by an electromagnetic force. The base portion is composed of a magnetic body. A tabular second magnetic body portion composed of a magnetic body that, when viewed from the incident light axis direction, occupies a region surrounding the external shape of the permanent magnet is arranged on the base portion side of the permanent magnet.

Image blur correction apparatus and camera

A camera according to the present invention includes a picture-taking lens unit including a picture-taking optical system having a bending optical system which optically bends incident light and an optical finder unit including a finder optical system having a bending optical system which optically bends incident light. A pre-bending optical system and a post-bending optical system in the bending optical system of the optical finder unit are arranged adjacent to a pre-bending optical system and a post-bending optical system in the bending optical system of the picture-taking lens unit, respectively. The body of the camera is therefore decreased in size.

Growing community of inventors

Hachioji, Japan

Takashi Okamura