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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12424494 B1

PDFFull Text
Date of Patent:
Sep. 23, 2025

Filed:

May. 26, 2021

Processing method of wafer

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Takashi Okamura, Tokyo, JP;

Shigenori Harada, Tokyo, JP;

Tomoharu Takita, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain Ltd.

Primary Examiner:

Julio J Maldonado

Assistant Examiner:

Stanetta D Isaac

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/6836 (2013.01); H01L 23/544 (2013.01); H01L 2221/68327 (2013.01); H01L 2223/5446 (2013.01);
Abstract

There is provided a processing method of a wafer for processing the wafer that includes, on a front surface side, a device region in which a device is formed in each of plural regions marked out by plural planned dividing lines and includes a recess part on the back surface side and includes an annular reinforcing part at a peripheral part. The processing method of a wafer includes a holding step of holding the bottom surface of the recess part, a cutting step of cutting the wafer along the planned dividing lines by a cutting blade to divide the device region into plural device chips and form grooves on the front surface side of the reinforcing part, and a dividing step of dividing the reinforcing part along the planned dividing lines with the grooves being the points of origin by giving an external force to the reinforcing part.

Find Patent Forward Citations

Okamura, Takashi. (2025). Processing method of wafer (U.S. Patent No. 12424494). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12424494

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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