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For the Inventor, By the Inventor

Tokyo, Japan

Takahiro Oka

This inventor holds 11 USPTO granted patents. Top assignee: Oki Electric Industry Co., Ltd.. Active years: 2000-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takahiro Oka. Retrieved from https://idiyas.com/inventor/takahiro-oka-44x3csxv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 11

% Patents Active = 63.6

Average Co-Inventor Count = 1.2

ph-index = 5

Forward Citations = 90(Granted Patents)


Company Filing History:

goldMedal11 out of 4,980 
 
Oki Electric Industry Co., Ltd.
 patents

Years Active: 2000-2007

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11 patents (USPTO):Explore Patents
1. 7211883 - Semiconductor chip package (2007-05-01),
2. 7075177 - Semiconductor chip package (2006-07-11),
3. 7067357 - Semiconductor package and method of fabricating same (2006-06-27),
4. 6948239 - Method for fabricating semiconductor apparatus using board frame (2005-09-27),
5. 6831354 - Semiconductor package and method of fabricating same (2004-12-14),
6. 6777264 - Method of manufacturing a semiconductor device having a die pad without a downset (2004-08-17),
7. 6551906 - Method of fabricating semiconductor device (2003-04-22),
8. 6512287 - Board frame, method for fabricating thereof and method for fabricating semiconductor apparatus (2003-01-28),
9. 6472729 - Semiconductor device (2002-10-29),
10. 6174751 - Method of manufacturing resin encapsulated semiconductor device (2001-01-16),
11. 6084300 - Compact resin-sealed semiconductor device (2000-07-04),

Title: Takahiro Oka: Innovator in Semiconductor Technology

Introduction

Takahiro Oka is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His innovative work has paved the way for advancements in semiconductor chip packaging.

Latest Patents

One of Oka's latest patents involves a semiconductor chip package that integrates a first semiconductor chip and a second semiconductor chip. These chips have electrodes for wiring at their surfaces and are mounted in a manner where their reverse surfaces oppose one another. This design allows for the free combination and mounting of two semiconductor chips, regardless of their sizes. Additionally, it shortens the lengths of wires, which improves wire-bonding yield and results in a semiconductor package with excellent electric characteristics.

Career Highlights

Oka has been associated with Oki Electric Industry Co., Ltd., where he has contributed to various projects and innovations in semiconductor technology. His work has been instrumental in enhancing the performance and efficiency of semiconductor devices.

Collaborations

Oka has collaborated with several professionals in his field, including his coworker Makoto Terui. Their joint efforts have led to the development of cutting-edge technologies in semiconductor packaging.

Conclusion

Takahiro Oka's contributions to semiconductor technology exemplify the spirit of innovation. His patents and collaborative efforts continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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