The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2000
Filed:
Dec. 08, 1997
Applicant:
Inventor:
Takahiro Oka, Tokyo, JP;
Assignee:
Oki Electric Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257730 ; 257737 ; 257738 ; 257666 ; 257692 ; 257693 ;
Abstract
A semiconductor device of the present invention is structured such that solder balls for packaging are fixed onto leads protruding from a package to obviate drawbacks inherent in the conventional lead frame type semiconductor device, wherein it is difficult to correspond to the layout of the increased number of pins due to an occurrence of flexure of the lead, and protrusions of the lead terminals from the package resin are disadvantageous for downsizing.
Quick Actions:
Oka, Takahiro. (2000). Compact resin-sealed semiconductor device (U.S. Patent No. 6084300). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6084300
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile