The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2001
Filed:
Jan. 18, 2000
Takahiro Oka, Tokyo, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Abstract
A method of manufacturing a semiconductor device comprises the steps of providing a semiconductor wafer including semiconductor chip regions each of which has a protruding electrode formed on a main surface of the semiconductor wafer and scribe lines surrounding the semiconductor chip regions and providing a substrate including main body portions each of which corresponds to one of the semiconductor chip regions and cut lines each of which corresponds to one of the scribe lines, each of the main body portions having an inner pad formed on a chip mounting surface of the substrate and a connecting pad formed on a back surface of the substrate, the inner pad corresponding to the protruding electrode, each of the cut lines has a resin injecting hole extending from the chip mounting surface to the back surface. The method further comprises the steps of mounting the chip mounting surface of the substrate on the main surface of the semiconductor wafer so that the protruding electrodes are connected to the inner pads, respectively, injecting a resin to a space between the chip mounting surface and the main surface through resin injecting holes, curing the injected resin, and cutting the substrate, the cured resin and the semiconductor wafer along the cut lines so that semiconductor devices each of which includes the semiconductor chip region of the semiconductor wafer, the cured resin and the main body portion of the substrate are provided.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile