The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 22, 2003
Filed:
Dec. 13, 2000
Takahiro Oka, Tokyo, JP;
Oki Electric Industry Co., Ltd., Tokyo, JP;
Abstract
A method of fabricating a semiconductor device is provided in which a protective tape for back grinding is adhered to a front surface of a wafer and back grinding processing is carried out. Thereafter, with the protective tape for back grinding adhered to the wafer, a tape-shaped adhesive for dice bonding is adhered to a reverse surface of the wafer. Thereafter, the protective tape for back grinding is peeled off, probing is carried out, and a protective tape for dicing is adhered to the tape-shaped adhesive for dice bonding. After dicing, semiconductor elements, to which the tape-shaped adhesive for dice bonding is adhered, are picked up by a pick up tool. Dice bonding is carried out by using the tape-shaped adhesive for dice bonding. In this way, even if the wafer is made thin, the wafer doesn't break during the fabricating process and costs don't increase.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile