The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2002
Filed:
Nov. 10, 1998
Takahiro Oka, Tokyo, JP;
OKI Electric Industry Co., Ltd., Tokyo, JP;
Abstract
A semiconductor device chip packaged in the semiconductor device in accordance with this invention has one or more grooves engraved along the rear surface thereof to allow the grooves to receive one or more connection bars and a die pad or an island, if any, for the purpose to make the total thickness of the semiconductor device chip and the connection bar or bars and the die pad or the island, much thinner than the sum of the thickness of the semiconductor device chip and the thickness of the connection bar or bars and the die pad or the island, for the ultimate purpose to cause the finished or molded thickness of the semiconductor device in accordance with this invention to be as thin as 1.0 mm, resultantly allowing a semiconductor ingot having a diameter of 300 mm for producing a semiconductor device chip to be molded in the semiconductor device in accordance with this invention.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile