The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2003

Filed:

Jun. 03, 1999
Applicant:
Inventor:

Takahiro Oka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/302 ;
Abstract

A board frame includes a wiring board region, which includes an island on which a semiconductor device is to be mounted; and a marginal region surrounding the wiring board region. The board frame further includes a frame region, which is located around the marginal region; and a support region which connects the wiring board region and the frame region. The marginal region is removed from the board frame and is put back to its original position, while the wiring board region is maintained being connected to the frame region through the support region.


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Oka, Takahiro. (2003). Board frame, method for fabricating thereof and method for fabricating semiconductor apparatus (U.S. Patent No. 6512287). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6512287

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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