Tai-Hung Lin

Title: Innovations of Tai-Hung Lin

Introduction

Tai-Hung Lin is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of microelectronics, holding a total of 11 patents. His work primarily focuses on advanced packaging technologies that enhance the performance and reliability of electronic components.

Latest Patents

One of Tai-Hung Lin's latest patents is the "Chip on Film Package." This innovative design includes a flexible film and a chip, where the flexible film comprises a film base and a patterned metal layer with multiple pads. The dummy metal layer is designed to dissipate heat from the chip, featuring openings that expose the second surface. The chip is mounted on the pads of the patterned metal layer, optimizing its functionality. Another notable patent is the "Chip on Film Package with Reinforcing Sheet and Manufacturing Method." This package includes a base film, a patterned circuit layer, a chip, and a reinforcing sheet. The reinforcing sheet is strategically placed to expose the chip while maintaining flexibility comparable to that of the base film.

Career Highlights

Tai-Hung Lin is currently employed at Novatek Microelectronics Corporation, a leading company in the semiconductor industry. His work at Novatek has allowed him to push the boundaries of microelectronic packaging, contributing to the company's reputation for innovation and quality.

Collaborations

Throughout his career, Tai-Hung Lin has collaborated with notable colleagues, including Chang-Tien Tsai and Wen-Ching Huang. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in the field.

Conclusion

Tai-Hung Lin's contributions to microelectronics through his innovative patents and collaborations highlight his role as a key figure in advancing technology. His work continues to influence the industry and pave the way for future innovations.