The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Oct. 12, 2012
Applicant:

Novatek Microelectronics Corp., Hsinchu, TW;

Inventor:

Tai-Hung Lin, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/544 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 24/11 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 21/6836 (2013.01); H01L 23/544 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2224/1184 (2013.01); H01L 2224/11845 (2013.01); H01L 2224/13083 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/27416 (2013.01); H01L 2224/27848 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81424 (2013.01); H01L 2224/81903 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/9211 (2013.01); H01L 2224/94 (2013.01); H01L 2924/15788 (2013.01);
Abstract

An IC chip package and a chip-on-glass structure using the same are provided. The IC chip package includes an IC chip having a circuit surface, and plural copper (Cu) bumps formed on the circuit surface. Moreover, a non-conductive film (NCF) could be formed on the circuit surface to cover the Cu bumps. The chip-on-glass structure includes a glass substrate, plural electrodes such as aluminum (Al) electrodes formed on the glass substrate, and a conductive film formed on the electrodes. The conductive film contains a number of conductive particles. When the IC chip package is coupled to the glass substrate, the Cu bumps can be coupled to the corresponding electrodes via conductive particles.


Find Patent Forward Citations

Loading…