logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10043737 B1

PDFFull Text
Date of Patent:
Aug. 07, 2018

Filed:

Oct. 28, 2016

Chip on film package

Applicant:

Novatek Microelectronics Corp., Hsinchu, TW;

Inventors:

Wen-Ching Huang, Hsinchu, TW;

Tai-Hung Lin, Hsinchu, TW;

Assignee:

Novatek Microelectronics Corp., Hsinchu, TW;

Attorney:

Jciprnet

Primary Examiner:

Theresa T Doan

Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/36 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49572 (2013.01); H01L 21/56 (2013.01); H01L 23/3164 (2013.01); H01L 23/36 (2013.01); H01L 23/49568 (2013.01); H01L 21/4882 (2013.01); H01L 23/3121 (2013.01); H01L 23/4985 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/15192 (2013.01);
Abstract

A chip on film package includes a base film, a chip and a heat-dissipation sheet. The base film includes a first surface. The chip is disposed on the first surface and having a chip length along a first axis of the chip. The heat-dissipation sheet includes a covering portion and a first extending portion connected to the covering portion and attached to first surface. The covering portion at least partially covers the chip and having a first length along the first axis. The first extending portion has a second length along the first axis substantially longer than the first length of the covering portion, and the covering portion exposes a side surface of the chip, wherein the side surface connects a top surface and a bottom surface of the chip.

Find Patent Forward Citations

Loading…