Hsinchu, Taiwan

Wen-Ching Huang


Average Co-Inventor Count = 2.5

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2018-2023

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9 patents (USPTO):Explore Patents

Title: Innovating Packaging Solutions: The Contributions of Wen-Ching Huang

Introduction

Wen-Ching Huang is a prominent inventor based in Hsinchu, Taiwan, with a notable portfolio of 9 patents to his name. His innovative work primarily focuses on advancements in packaging solutions for microelectronics, highlighting his significant contributions to the tech industry.

Latest Patents

Huang's latest patents include cutting-edge designs for chip-on-film packages. One such patent describes a chip on film package that incorporates a flexible film and a chip. This innovative design features a film base with a patterned metal layer containing multiple pads on its upper surface. It also includes a dummy metal layer on the lower surface, designed to effectively dissipate heat from the chip. This dummy layer contains strategic openings that expose the film base, ensuring optimal thermal management.

Another recent patent presents a similar chip on film package, where the chip is mounted on the flexible film equipped with bumps. This flexible film includes first and second vias, along with upper and lower leads, arranged strategically to maximize distance efficiency. Such designs embody Huang's dedication to enhancing microelectronic packaging.

Career Highlights

Wen-Ching Huang has made significant strides in his career while working at Novatek Microelectronics Corporation. His role at this leading microelectronics company has provided him with a platform to develop and refine his innovative ideas, contributing to both the company's success and the industry's overall growth.

Collaborations

Throughout his career, Huang has had the opportunity to collaborate with talented individuals such as Chien-Chen Ko and Tai-Hung Lin. These collaborations have been instrumental in achieving breakthroughs in packaging technologies, showcasing the strength of teamwork in driving innovation.

Conclusion

Wen-Ching Huang's contributions to the field of microelectronics packaging exemplify the spirit of innovation and invention. With a solid number of patents to his name and a commitment to advancing the industry, he continues to be a pivotal figure in the technological landscape. His work not only benefits Novatek Microelectronics Corporation but also sets a benchmark for future developments in the realm of microelectronic packaging solutions.

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