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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10643921 B1

PDFFull Text
Date of Patent:
May. 05, 2020

Filed:

Aug. 06, 2019

Chip on film package

Applicant:

Novatek Microelectronics Corp., Hsinchu, TW;

Inventors:

Wen-Ching Huang, Hsinchu, TW;

Chien-Chen Ko, Hsinchu, TW;

Ling-Chieh Li, Hsinchu County, TW;

Assignee:

Novatek Microelectronics Corp., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Kyoung Lee

Int. Cl.
CPC ...
H01L 23/373 (2006.01); B32B 7/12 (2006.01); B32B 37/14 (2006.01); H01L 23/367 (2006.01); B32B 9/00 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); B32B 37/12 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); B32B 7/12 (2013.01); B32B 9/007 (2013.01); B32B 37/12 (2013.01); B32B 37/14 (2013.01); H01L 21/481 (2013.01); H01L 23/315 (2013.01); H01L 23/3142 (2013.01); H01L 23/367 (2013.01); H01L 23/3735 (2013.01); H01L 23/4985 (2013.01); H01L 23/49838 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); B32B 2457/00 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/00014 (2013.01);
Abstract

A chip on film package includes a base film, a patterned circuit layer, a chip and a heat dissipation sheet. The base film includes a first surface and a mounting region located on the first surface. The patterned circuit layer is disposed on the first surface. The chip is disposed on the mounting region and electrically connected to the patterned circuit layer. The heat dissipation sheet includes a first adhesive layer disposed over the base film, a second adhesive layer disposed over the first adhesive layer, and a graphite layer disposed between the first adhesive layer and the second adhesive layer, wherein at least one of the first adhesive layer and the second adhesive layer is a double-sided adhesive with carrier, which comprises two adhesives and a carrier disposed between the two adhesives.

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