This inventor holds 5 USPTO granted patents and 4 published patent applications. Top assignee: Novatek Microelectronics Corp.. Active years: 2018-2022.
Company Filing History:
Years Active: 2018-2022
Title: Chien-Chen Ko: Innovator in Microelectronics
Introduction
Chien-Chen Ko is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of microelectronics, holding a total of 5 patents. His innovative work focuses on advanced packaging structures that enhance the performance and efficiency of electronic devices.
Latest Patents
One of his latest patents is a package structure with a separated street between chips. This design includes a first chip connected to a pair of first signal lines and multiple first power lines, while a second chip is connected to a pair of second signal lines and several second power lines. Notably, a separated street exists between the first and second chips, which belong to a common wafer. Another significant patent is the chip on film package, which comprises a base film, a patterned circuit layer, a chip, and a heat dissipation sheet. The base film features a mounting region where the chip is electrically connected to the patterned circuit layer, and the heat dissipation sheet is designed with multiple adhesive layers and a graphite layer for improved thermal management.
Career Highlights
Chien-Chen Ko is currently employed at Novatek Microelectronics Corporation, a leading company in the semiconductor industry. His work at Novatek has allowed him to push the boundaries of microelectronic packaging technologies, contributing to the company's reputation for innovation and excellence.
Collaborations
Throughout his career, Chien-Chen Ko has collaborated with talented individuals such as Wen-Ching Huang and Ling-Chieh Li. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies in the field.
Conclusion
Chien-Chen Ko's contributions to microelectronics through his innovative patents and collaborations highlight his role as a key figure in advancing technology. His work continues to influence the industry and pave the way for future innovations.