The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 2023

Filed:

Feb. 26, 2021
Applicant:

Novatek Microelectronics Corp., Hsinchu, TW;

Inventors:

Chun-Yu Liao, Kaohsiung, TW;

Teng-Jui Yu, Taoyuan, TW;

Jr-Ching Lin, Hsinchu, TW;

Wen-Ching Huang, Hsinchu, TW;

Tai-Hung Lin, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 23/3185 (2013.01); H01L 23/367 (2013.01); H01L 23/5387 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17519 (2013.01); H01L 2924/18161 (2013.01);
Abstract

A chip on film package is disclosed, including a flexible film and a chip. The flexible film includes a film base, a patterned metal layer includes a plurality of pads and disposed on an upper surface of the film base, and a dummy metal layer covering a lower surface of the film base and capable of dissipating heat of the chip. The dummy metal layer comprises at least one opening exposing the second surface, and at least one of the plurality of pads is located within the at least one opening in a bottom view of the chip on film package. The chip is mounted on the plurality of pads of the patterned metal layer.


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