Location History:
- Kao-Hsiung, TW (2010 - 2011)
- Hsinchu, TW (2010 - 2023)
Company Filing History:
Years Active: 2010-2023
Title: Jr-Ching Lin: Innovator in Chip on Film Packaging
Introduction
Jr-Ching Lin is a notable inventor based in Hsinchu, Taiwan, recognized for his contributions to the field of microelectronics. With a total of 10 patents to his name, his work primarily revolves around innovative packaging solutions for electronic components.
Latest Patents
One of his significant inventions is a chip on film package, which includes a flexible film and a chip. This package features a film base along with a patterned metal layer that includes several pads, strategically positioned on the upper surface to facilitate mounting. Notably, the design also incorporates a dummy metal layer on the lower surface, which is capable of dissipating heat generated by the chip. This innovative approach includes openings in the dummy metal layer, providing exposure to the lower surface and accommodating the pads.
In another patent, Lin's chip on film package comprises a flexible film with distinct first and second surfaces. The patterned circuit layer is installed on the first surface, with the chip mounted on it and electronically connected to the circuit layer. The second surface is covered by a dummy metal layer, designed to effectively dissipate heat while remaining insulated from the circuit layer, enhancing the reliability and performance of electronic devices.
Career Highlights
Jr-Ching Lin is currently employed at Novatek Microelectronics Corporation, a company renowned for its advancements in microelectronics and semiconductor solutions. Throughout his career, Lin has demonstrated a dedication to developing innovative technologies that improve the efficiency and functionality of electronic packaging.
Collaborations
Lin collaborates with talented individuals, including his colleagues Hsin-Hung Lee and Chia-Wei Su, who share his vision for pioneering advancements in technology. Their collaborative efforts contribute to the continuous growth and success of Novatek Microelectronics Corporation in the competitive microelectronics industry.
Conclusion
Jr-Ching Lin stands out as a prominent inventor in the realm of chip on film packaging. His innovative patents not only reflect his expertise but also contribute significantly to the advancement of electronics. As he continues to develop new technologies at Novatek Microelectronics Corporation, his contributions will undoubtedly play a pivotal role in shaping the future of microelectronics.