The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 2015

Filed:

Oct. 25, 2013
Applicant:

Novatek Microelectronics Corp., Hsinchu, TW;

Inventors:

Tai-Hung Lin, Hsinchu, TW;

Chang-Tien Tsai, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/60 (2006.01); H01L 23/00 (2006.01); H01L 27/02 (2006.01); H01L 23/49 (2006.01);
U.S. Cl.
CPC ...
H01L 23/60 (2013.01); H01L 24/05 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/01029 (2013.01); H01L 24/48 (2013.01); H01L 2224/05095 (2013.01); H01L 24/06 (2013.01); H01L 2224/02166 (2013.01); H01L 27/0248 (2013.01); H01L 2224/451 (2013.01); H01L 23/49 (2013.01); H01L 24/42 (2013.01);
Abstract

An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit and a second circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically coupled to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically coupled to the second circuit. The second internal bonding pad is electrically coupled to the first internal bonding pad via the bonding wire. The external bonding pad is electrically coupled to the first internal bonding pad.


Find Patent Forward Citations

Loading…