Company Filing History:

6 out of 396

Henkel IP Holding Gmbh

patents

5 out of 2,018

Henkel Ag & Company, Kgaa

patents

4 out of 90,594

Canon Kabushiki Kaisha

where one patent can have more than one assignee

Years Active: 1986-2021

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12 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 11203181 - Barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packages (2021-12-21),

2. 10446518 - Sinterable bonding material and semiconductor device using the same (2019-10-15),

3. 10242923 - Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages (2019-03-26),

4. 10141283 - Sinterable bonding material and semiconductor device using the same (2018-11-27),

5. 9994681 - Organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same (2018-06-12),

6. 9865551 - Methods to control wafer warpage upon compression molding thereof and articles useful therefor (2018-01-09),

7. 8835574 - Adhesive compositions for use in die attach applications (2014-09-16),

8. 8338536 - Adhesive compositions for use in die attach applications (2012-12-25),

9. 6078765 - Image forming apparatus (2000-06-20),

10. 5790922 - Image forming apparatus constructed to have a high heat radiating (1998-08-04),

11. 5008607 - Driving system for stepping motor (1991-04-16),

12. 4581657 - Image reading device (1986-04-08),

Title: The Innovations of Tadashi Takano

Introduction

Tadashi Takano is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced bonding materials and underfill films for semiconductor applications. With a total of 12 patents to his name, Takano's work has had a substantial impact on the industry.

Latest Patents

One of his latest patents is focused on a barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packages. This invention provides stabilized underfill film-containing assemblies that extend the work-life and shelf-life of underfill films. Additionally, he has developed methods for enhancing the longevity of these films. Another notable patent is for a sinterable bonding material and semiconductor device using the same. This invention aims to provide a bonding material that ensures long-term reliability, comprising a silver filler and resin particles with specific properties that enhance bonding strength and heat-release characteristics.

Career Highlights

Throughout his career, Tadashi Takano has worked with notable companies such as Henkel IP & Holding GmbH and Henkel AG & Company, KGaA. His experience in these organizations has allowed him to refine his expertise in materials and semiconductor technologies.

Collaborations

Some of his coworkers include Hajime Inoue and Jie Bai, who have collaborated with him on various projects, contributing to the advancement of their shared field.

Conclusion

Tadashi Takano's innovative work in the field of materials science and semiconductor technology has led to significant advancements that benefit the industry. His patents reflect a commitment to improving the reliability and performance of essential materials used in modern technology.

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1 patent (EPO):

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