Henkel IP Holding Gmbh

Henkel Ag & Company, Kgaa

Canon Kabushiki Kaisha

Henkel Corporation

Tadashi Takano

Hajime Inoue

My Nhu Nguyen

Puwei Liu

Jie Bai

Yusuke Horiguchi

Takeshi Ono

Hao Wu

Hui Li

Masahiro Sakamoto

Zhiming Li

Hideaki Nagahara

Hong Jiang

Daigo Nakagawa

Liwei Zhang

Juan Du

Gina Hoang

Mieko Sano

Wentao Xing

Wenjuan Tan

Qiaohong Huang

Younsang Kim

Hung Chau

Youko Murata

Aya Hikita

Carol Yang

Provided herein are stabilized underfill film-containing assemblies which extend the work-life of underfill films. In accordance with certain aspects of the present invention, there are also provided stabilized underfill film-containing assemblies which extend the shelf-life of underfill films. In certain aspects of the present invention, there are also provided methods for extending the work-life of underfill films. In another aspect of the present invention, there are also provided methods for extending the shelf-life of underfill films.

Barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packages

An objective of the present invention is to provide a sinterable bonding material capable of providing a bonded article having a long-term reliability. The present invention relates to a sinterable bonding material comprising a silver filler and resin particles, wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less; and the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200&#xb0; C. or more. The sintered product of the sinterable bonding material of the present invention is excellent in bonding strength and heat-release characteristics, and has an improved stress relaxation ability.

Sinterable bonding material and semiconductor device using the same

Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.

Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages

An objective of the present invention is to provide a sinterable bonding material excellent in sinterability. The present invention relates to a sinterable bonding material comprising a silver filler and an organic base compound as a sintering promoter.

The present invention discloses an organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same, particularly used as an encapsulant in light emitting diodes.

Organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same

Provided herein are multilayer structures having a reduced propensity to warp upon curing of certain components thereof. In one aspect, there are provided multilayer assemblies comprising a plurality of the above-described multilayer structures. In another aspect, there are provided methods for reducing wafer warpage upon cure of molding compositions applied thereto. In yet another aspect, there are provided methods for preparing wafers having substantially no warpage upon cure thereof.

Methods to control wafer warpage upon compression molding thereof and articles useful therefor

Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40&#xb0; C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.

Adhesive compositions for use in die attach applications

An image forming apparatus has an image reading portion provided in an upper portion of an apparatus body on the side of its front surface, an optical signal generating portion provided in rear of the image reading portion, an image forming portion disposed downwardly of the optical signal generating portion, a fixing portion provided in the vicinity of a lower portion of the apparatus body on its front surface side, a sheet discharge portion, disposed between the image forming portion, the optical signal generating portion and the image reading portion, to which to discharge the record sheet onto which a toner image is fixed by the fixing portion, and an opening/closing cover rotated integrally with the image reading portion and the sheet discharge portion. When the opening/closing cover is opened, the image forming portion is exposed and a part of a sheet carry path extending from the fixing portion to the sheet discharge portion is made open. It is therefore possible to easily replace and repair the parts of the image forming portion and also operate a jam treatment of the record sheets.

Image forming apparatus

An image forming portion is arranged below a photosignal scanning portion. An original reading portion is arranged in the horizontal direction of the photosignal scanning portion. A fixing portion is arranged between the photosignal scanning portion and the original reading portion. A radiation duct having a recording paper ejecting portion is arranged above the fixing portion. Thus, an influence by the heat of the fixing portion on the photosignal scanning portion and image reading portion is eliminated. A second recording paper ejecting portion is provided below the original reading portion. By the selection of the second recording paper ejecting portion and the recording paper ejecting portion, the face-up paper ejection and the face-down paper ejection can be selected.

Image forming apparatus constructed to have a high heat radiating

A driving system for a stepping motor wherein the stepping motor is rotated by a predetermined angle for each driving step. The system counts the time between two successive driving triggers, and changes at least one of the phase energization current and the phase energization time at the start of the driving of the stepping motor in response to the time count.

Driving system for stepping motor

An image reading device in which a solid-state image pick up element is mounted on a reference plane of a support member which is in turn maintained in pressure contact with a reference plane of a substrate. The solid-state image sensor is thus fixed at a determined position.

Growing community of inventors

Yokohama, Japan

Tadashi Takano