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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10446518 B1

PDFFull Text
Date of Patent:
Oct. 15, 2019

Filed:

Jun. 23, 2017

Sinterable bonding material and semiconductor device using the same

Applicants:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Henkel Ip & Holding Gmbh, Duesseldorf, DE;

Inventors:

Hajime Inoue, Yokohama, JP;

Tadashi Takano, Yokohama, JP;

Assignees:

HENKEL AG & CO. KGAA, Duesseldorf, DE;

HENKEL IP & HOLDING GMBH, Duesseldorf, DE;

Attorney:

Steven C. Bauman

Primary Examiner:

Syed I Gheyas

Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 35/02 (2006.01); B22F 1/00 (2006.01); B22F 3/22 (2006.01); B22F 7/04 (2006.01); B22F 7/08 (2006.01); H05K 3/32 (2006.01); B22F 7/06 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B22F 1/0055 (2013.01); B22F 1/0059 (2013.01); B22F 1/0074 (2013.01); B22F 3/22 (2013.01); B22F 7/04 (2013.01); B22F 7/08 (2013.01); B23K 35/0244 (2013.01); H01L 24/29 (2013.01); B22F 7/064 (2013.01); B22F 2007/047 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/2949 (2013.01); H01L 2224/2969 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83222 (2013.01); H01L 2224/83411 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83455 (2013.01); H05K 3/32 (2013.01); H05K 2203/1131 (2013.01);
Abstract

An objective of the present invention is to provide a sinterable bonding material capable of providing a bonded article having a long-term reliability. The present invention relates to a sinterable bonding material comprising a silver filler and resin particles, wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less; and the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200° C. or more. The sintered product of the sinterable bonding material of the present invention is excellent in bonding strength and heat-release characteristics, and has an improved stress relaxation ability.

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