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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10242923 B1

PDFFull Text
Date of Patent:
Mar. 26, 2019

Filed:

Apr. 05, 2018

Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3d tsv packages

Applicants:

Henkel Ip & Holding Gmbh, Duesseldorf, DE;

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Jie Bai, Aliso Viejo, CA (US);

Qiaohong Huang, Trabuco Canyon, CA (US);

Hong Jiang, Irvine, CA (US);

Youko Murata, Kanagawa, JP;

Yusuke Horiguchi, Kanagawa, JP;

YounSang Kim, Foothill Ranch, CA (US);

Tadashi Takano, Yokohama, JP;

Assignees:

HENKEL IP & HOLDING GMBH, Duesseldorf, DE;

HENKEL AG & CO. KGAA, Duesseldorf, DE;

Attorney:

Taylor M. Coon

Primary Examiner:

S V Clark

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/29 (2006.01); C08G 59/18 (2006.01); C08K 5/09 (2006.01); C08L 33/04 (2006.01); C08L 63/00 (2006.01); C09D 4/06 (2006.01); C08F 283/10 (2006.01); H01L 21/56 (2006.01); C09D 163/00 (2006.01); C08K 3/36 (2006.01); C08L 33/06 (2006.01); C08L 79/08 (2006.01); C08L 33/08 (2006.01); C08L 39/04 (2006.01); G01N 25/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/293 (2013.01); C08F 283/10 (2013.01); C08G 59/18 (2013.01); C08K 3/36 (2013.01); C08K 5/09 (2013.01); C08L 33/04 (2013.01); C08L 33/06 (2013.01); C08L 33/08 (2013.01); C08L 39/04 (2013.01); C08L 63/00 (2013.01); C08L 79/085 (2013.01); C09D 4/06 (2013.01); C09D 163/00 (2013.01); H01L 21/563 (2013.01); C08L 2203/20 (2013.01); G01N 25/4866 (2013.01);
Abstract

Provided herein are mixed resin systems and the use thereof for wafer-level underfill (WAUF) for three-dimensional TSV packages. In one aspect, there are provided compositions comprising (1) an epoxy resin, (2) a maleimide, nadimide or itaconamide, (3) an acrylate and (4) a filler. In certain aspects, the epoxy resin is a siloxane-modified resin. In certain aspects, the invention relates to underfill films prepared from invention compositions. In certain aspects, the invention relates to articles comprising the underfill films described herein.

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