This inventor holds 1 USPTO granted patent. Top assignees: Henkel Ag & Company, Kgaa, Henkel IP Holding Gmbh. Active years: 2019.
Company Filing History:
1 out of 4,532 
1 out of 396 
Years Active: 2019
Title: Youko Murata: Innovator in Wafer-Level Underfill Technologies
Introduction
Youko Murata is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of materials science, particularly in the development of formulations for wafer-level underfill in three-dimensional TSV packages. His innovative work has implications for the electronics industry, enhancing the reliability and performance of semiconductor devices.
Latest Patents
Youko Murata holds 1 patent for his invention titled "Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages." This patent describes mixed resin systems that include compositions comprising an epoxy resin, a maleimide, nadimide or itaconamide, an acrylate, and a filler. The invention also discusses underfill films prepared from these compositions, which are crucial for improving the performance of electronic packages.
Career Highlights
Throughout his career, Youko Murata has worked with prominent companies in the industry, including Henkel IP Holding GmbH and Henkel AG & Company, KGaA. His experience in these organizations has allowed him to collaborate on various projects that advance the field of materials used in electronics.
Collaborations
Youko has collaborated with talented individuals such as Jie Bai and Qiaohong Huang, contributing to the development of innovative solutions in his field.
Conclusion
Youko Murata's contributions to the field of wafer-level underfill technologies demonstrate his commitment to innovation and excellence. His work continues to influence the electronics industry, paving the way for future advancements.