Yokohama, Japan

Yusuke Horiguchi

USPTO Granted Patents = 5 


Average Co-Inventor Count = 3.6

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Yokohama, JP (2016 - 2017)
  • Kanagawa, JP (2019 - 2021)

Company Filing History:


Years Active: 2016-2021

Loading Chart...
Loading Chart...
5 patents (USPTO):Explore Patents

Title: Yusuke Horiguchi: Innovator in Underfill Film Technology

Introduction

Yusuke Horiguchi is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of materials science, particularly in the development of underfill films for advanced packaging technologies. With a total of 5 patents, Horiguchi's work has been instrumental in enhancing the performance and longevity of electronic components.

Latest Patents

Horiguchi's latest patents include innovative solutions for underfill films used in 3D TSV (Through-Silicon Via) packages. One of his notable inventions is a barrier film-containing format that extends the work-life and shelf-life of underfill films. This invention provides stabilized underfill film-containing assemblies, which are crucial for maintaining the integrity of electronic devices over time. Another significant patent involves formulations containing mixed resin systems for wafer-level underfill, which includes compositions of epoxy resin, maleimide, acrylate, and fillers. These advancements are vital for improving the reliability of 3D TSV packages.

Career Highlights

Throughout his career, Horiguchi has worked with reputable companies such as Henkel AG & Company and Henkel IP & Holding GmbH. His experience in these organizations has allowed him to refine his expertise in materials science and patent development. His contributions have not only advanced the technology but have also positioned him as a key figure in the industry.

Collaborations

Horiguchi has collaborated with notable professionals in his field, including Kenichiro Sato and Mieko Sano. These partnerships have fostered innovation and have led to the successful development of new technologies in underfill film applications.

Conclusion

Yusuke Horiguchi's work in the field of underfill films has significantly impacted the electronics industry. His innovative patents and collaborations highlight his dedication to advancing technology and improving product reliability. His contributions will continue to influence the future of electronic packaging solutions.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…