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For the Inventor, By the Inventor

Aliso Viejo, CA, United States of America

Jie Bai

This inventor holds 8 USPTO granted patents and 6 published patent applications. Top assignees: Henkel IP Holding Gmbh, Henkel Ag & Company, Kgaa. Active years: 2014-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jie Bai. Retrieved from https://idiyas.com/inventor/jie-bai-aw5ui1ks

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 8 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:

goldMedal7 out of 396 
 
Henkel IP Holding Gmbh
 patents
silverMedal3 out of 4,541 
 
Henkel Ag & Company, Kgaa
 patents
where one patent can have more than one assignee

Years Active: 2014-2023

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8 patents (USPTO):Explore Patents
1. 11578202 - Liquid compression molding encapsulants (2023-02-14),
2. 11203181 - Barrier film-containing format and the use thereof for pre-applied underfill film for 3D TSV packages (2021-12-21),
3. 10927249 - Resin compositions for underfill film for three dimensional through silica via (TSV) packages and compositions useful for the preparation thereof (2021-02-23),
4. 10913879 - Thermally conductive pre-applied underfill formulations and uses thereof (2021-02-09),
5. 10242923 - Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages (2019-03-26),
6. 9263360 - Liquid compression molding encapsulants (2016-02-16),
7. 8847415 - Liquid compression molding encapsulants (2014-09-30),
8. 8829694 - Thermosetting resin compositions with low coefficient of thermal expansion (2014-09-09),

Title: The Innovations of Jie Bai

Introduction

Jie Bai is a prominent inventor based in Aliso Viejo, CA (US). He has made significant contributions to the field of materials science, particularly in the development of advanced encapsulation techniques. With a total of 8 patents to his name, Bai's work has had a substantial impact on the industry.

Latest Patents

Among his latest patents, Jie Bai has developed a liquid compression molding encapsulant that utilizes thermosetting resin compositions. This innovation is particularly useful for the liquid compression molding encapsulation of reconfigured wafers. The encapsulated molded wafers demonstrate improved resistance to warpage compared to those encapsulated with traditional materials. Another notable patent involves barrier film-containing formats, which provide stabilized underfill film-containing assemblies. These assemblies extend the work-life and shelf-life of underfill films, showcasing Bai's commitment to enhancing the durability and performance of electronic components.

Career Highlights

Throughout his career, Jie Bai has worked with notable companies such as Henkel IP Holding GmbH and Henkel AG & Company, KGaA. His experience in these organizations has allowed him to refine his expertise in materials and encapsulation technologies.

Collaborations

Jie Bai has collaborated with talented individuals in his field, including Ly Do and Hung Chau. These partnerships have contributed to the advancement of his innovative projects and patents.

Conclusion

Jie Bai's contributions to the field of materials science and encapsulation technology are noteworthy. His innovative patents and collaborations reflect his dedication to improving electronic component performance. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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